Copper Wire Bonding

* Read * Copper Wire Bonding by Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht ↠ eBook or Kindle ePUB. Copper Wire Bonding  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  Copper Wire Bonding book lays out the challenges involved in replacing gold wi

Copper Wire Bonding

Author :
Rating : 4.93 (949 Votes)
Asin : 1461457602
Format Type : paperback
Number of Pages : 235 Pages
Publish Date : 2014-03-29
Language : English

DESCRIPTION:

"Copper Wire Bonding" according to Cliff Schuring. Good book was hoping for a little more information, but better that anything else I have. Hope to see a more detailed book on this in the very near future, and a lot more information on coated copper wires.

She is currently a technology development Q&R engineer at Intel Corporation.Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological Univers

 Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changesbond force, electric flame off, current and ultrasonic energy optimizati

Valuable as a learning tool for copper wire bonding, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan, Classe Francis, Bak Lee Chan and Hashim Uda, Microelectronics Reliability, November, 2013). It is a good resource to demonstrate the many facets of copper wire bonding, and can serve as a very informative technical reference. From the reviews:“The book gives a wide perspective on the technical insights of copper wire bonding deployment in industry while

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